With Productronica 2023 on the horizon, Finetech is gearing up to showcase its advanced SMD rework solutions at booth A4.181. Known for its reliable rework systems, Finetech is set to make electronics production more sustainable, resource-efficient, and less dependent on supply chains. Finetech’s advanced rework systems, based on hot air technology, target professional rework of […]
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As the countdown to Productronica 2023 begins, Finetech is gearing up to showcase its cutting-edge manual and automatic die bonders at booth B2-403. With over 30 years of experience in high-precision micro assembly and advanced die attach, Finetech is a leading supplier in the industry. The company’s mission is clear: to bring your visions to […]
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Finetech, a leading provider of precision die-bonders, announces the Promex purchase of the FINEPLACER® sigma. This is the second FINEPLACER® system implemented by Promex, joining a FINEPLACER® pico system purchased in 2019. Finetech is excited to see how the new sigma system will enable Promex to expand manufacturing for their customers in areas such as automotive, biotech, medical and […]
Read MoreFounded in 1992 as an East Berlin "start-up", today Finetech GmbH & Co. KG is a leading global manufacturer of placement, assembly and rework systems for customers in the microelectronics industry. This year, the company celebrates its 30th anniversary. It all started in a rented apartment in Berlin-Friedrichshain: shortly after German reunification, an East Berlin […]
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1992 als Ost-Berliner „Start-up“ gegründet, ist die Finetech GmbH & Co. KG heute ein weltweit führender Hersteller von Platzier-, Montage- und Reworksystemen für Kunden in der Mikroelektronik. In diesem Jahr feiert das Unternehmen sein 30-jähriges Jubiläum. In einer Mietswohnung in Friedrichshain fing alles an: kurz nach der deutschen Wiedervereinigung baute und vermarktete ein Ost-Berliner Ingenieur […]
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Finetech’s high-accuracy placement and assembly systems support customers from the photonics and optoelectronics industry in cost-efficient product development and transfer to automated manufacturing. With the sub-micron table top flip-chip and die bonder FINEPLACER® lambda 2 and the production platform FINEPLACER® femto 2, the Berlin-based precision machine manufacturer offers integrated high-accuracy die attach equipment and process […]
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With the help of a fully automated multi-chip bonder from Finetech, the Berlin-based laser specialists at Lumics have been able to improve reliability of their diode laser module manufacturing and to significantly increase production volume. Lumics GmbH, founded in 2000 and member of B.I.G. Berlin Industrial Group, is a key player for design and manufacturing […]
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Dr. Shih-Wei Lin is a researcher and die bonding specialist at Professor Weileun Fang’s Micro Device Laboratory of the National Tsing Hua University, Taiwan. Main focus of the Micro Device Laboratory is the design, fabrication and testing of innovative micro sensors and actuators for applications in the fields of IoT, mobile phone and smart X. For example, this […]
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Die Berliner Laserspezialisten von Lumics konnten mit Hilfe eines vollautomatischen Multi-Chip-Bonder von Finetech ihre Produktion von Diodenlasermodulen zuverlässiger und unabhängiger machen und den Fertigungsumfang deutlich erhöhen. Die Lumics GmbH, gegründet im Jahr 2000 und Mitglied der B.I.G. Berlin Industrial Group, ist ein wichtiger Akteur bei der Entwicklung und Herstellung von Diodenlasern für anspruchsvolle medizinische, industrielle und […]
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Dr. Shih-Wei Lin ist Forscher und Die-Bonding-Spezialist am Micro Device Laboratory von Professor Weileun Fang an der National Tsing Hua University (NTHU), Taiwan. Schwerpunkt der Arbeit des Micro Device Laboratory ist die Entwicklung, Herstellung und Erprobung innovativer Mikrosensoren und -aktoren für Anwendungen in den Bereichen IoT, Mobiltelefonie und Smart X. Dazu zählen beispielsweise MEMS-Mikrofone oder taktile Kraftsensoren für hochpräzise […]
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