Zusammenfassung: Basierend auf AMD Ryzen™ Embedded 8000-Prozessoren für leistungsstarke Performance. 8-Kern- und 16-Thread-Verarbeitung mit AMD RDNA™ 3-Grafik für beschleunigtes Multitasking und beeindruckende Grafik. Erreichen Sie mit den Zen 4-, RDNA™ 3- und XDNA™-Architekturen bis zu 40 TOPS AI-Inferenzleistung für verbesserte On-Device-Intelligenz. Unterstützt bis zu 96 GB DDR5 mit ECC für zuverlässige Datenintegrität und Systemstabilität. […]
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Summary: Built on AMD Ryzen™ Embedded 8000 Series processors for powerhouse performance. Deploy 8-core, 16-thread processing with AMD RDNA™ 3 graphics for accelerated multitasking and immersive visuals. Achieve up to 40 TOPS of AI inferencing performance with Zen 4, RDNA™ 3, and XDNA™ architectures for enhanced on-device intelligence. Support up to 96GB DDR5 with […]
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Summary: Expanded 3.5” SBC Portfolio: ADLINK introduces SBC35-MTL and SBC35-ASL, targeting both high-performance AI and rugged embedded edge applications. AI-Ready & Rugged Designs: SBC35-MTL features Intel® Core™ Ultra with integrated NPU for real-time inferencing; SBC35-ASL offers wide-temp, fanless operation with Intel® Atom® x7000RE. Flexible I/O with SBC-FM Modules: Both models support ADLINK’s SBC-FM expansion […]
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Summary: Next-Generation DLAP Expandable Edge AI Platforms: Purpose-built to meet the surging demand for edge AI solutions with flexible expansion and rugged designs. High-Performance AI Computing: Delivers scalable AI processing power up to 91.1 TFLOPS with support for NVIDIA RTX 6000 ADA GPUs, enabling real-time decision-making at the edge. Versatile Industrial Applications: Optimized for […]
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ADLINK will showcase enhanced robotic vision solutions at NVIDIA GTC Paris, June 10-12, in Paris, France. From AI modules to AI platforms and AI GPU servers, ADLINK delivers solutions that meet a broad spectrum of AI performance needs. ADLINK Technology Inc., a global leader in edge computing with 30 years of innovation and an NVIDIA […]
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Zusammenfassung: High Performance Computing: Ausgestattet mit Intel® 14th Gen Core™ Prozessoren bietet die EMP-520 Serie hohe Rechenleistung für nahtloses Multitasking und effizientes Management hoher Arbeitslasten. Hervorragendes visuelles Erlebnis: Die Serie unterstützt vier simultane 4K-Videoausgänge mit EDID-Emulation und bietet lebendige und konsistente Displays, die ideal für dynamische Digital Signage-Umgebungen sind. Zuverlässiges Design: Die EMP-520-Serie ist für […]
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Summary: High-Performance Computing: Equipped with Intel® 14th Gen Core™ processors, the EMP-520 Series delivers powerful processing, ensuring seamless multitasking and efficient management of heavy workloads. Superior Visual Experience: The series supports four simultaneous 4K video outputs with EDID emulation, providing vibrant and consistent displays ideal for dynamic digital signage environments. Reliable Design: Built to last […]
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Powered by the Intel® Core™ Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency. 64GB LPDDR5x memory soldered directly onto the board, supporting maximum performance in a 95x70mm form factor, with an operating temperature range of -40°C to 85°C. […]
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Angetrieben von der Intel® Core™ Ultra-Architektur mit bis zu 14 CPU Cores, 8 Xe-GPU Cores und einer integrierten NPU für leistungsstarke KI-Beschleunigung, die Ultra-Power mit Energieeffizienz verbindet. 64 GB LPDDR5x-Speicher, der direkt auf die Platine gelötet ist und maximale Leistung in einem Formfaktor von 95 x 70 mm mit einem Betriebstemperaturbereich von -40 °C bis […]
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Summary: ADLINK will launch its latest Open Standard Modules (OSM) product line, featuring MediaTek’s latest SoC for small-size, cost-effective, and energy-efficient embedded modules at Embedded World 2025. The booth will also showcase new Edge AI Vision Accelerators, MXE-230 Edge Computing Platform equipped with Hailo-8 AI accelerator designed to achieve 26 TOPS edge AI computing capabilities […]
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