congatec – the leading vendor of embedded and edge computing technology – is enhancing the performance and scalability of its AMD Ryzen™ AI Embedded P100 Series COM Express 3.1 Type 6 Compact modules. The conga-TCRP1 is now available in six new variants with eight, ten, or twelve CPU cores. This makes them an ideal fit for cost-sensitive designs […]
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congatec – der führende Anbieter von Embedded- und Edge-Computing-Technologie – erhöht die Performance und Skalierbarkeit seiner AMD Ryzen AI Embedded P100 Series basierten COM Express 3.1 Type 6 Compact Module. Das conga-TCRP1 ist ab sofort in sechs neuen Varianten mit 8, 10 oder 12 CPU-Kernen verfügbar. Dadurch eignet es sich ideal für kostenoptimierte Designs, die […]
Read Morecongatec – the leading provider of embedded and edge computing technology – today announced its new Customer Application Center and the launch of aReady.YOURS. With this move, congatec expands its aReady. hardware and software building blocks portfolio to include comprehensive customization design and software integration services, delivering near turnkey embedded computing platforms to OEM customers. aReady.YOURS supports customers throughout […]
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congatec – the leading vendor of embedded and edge computing technology – today announced the establishment of its new subsidiary in Penang, Malaysia, marking a strategic expansion of its engineering and research footprint in Asia. The move signals congatec’s commitment to anchoring high-value embedded computing design, customisation and technical support capabilities in Malaysia as part […]
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congatec – der führende Anbieter von Embedded- und Edge-Computing-Technologie – gibt den Launch einer neuen COM Express 3.1 Type 6 Compact Modulserie bekannt. Die neuen conga-TCRP1 basieren auf den neuesten AMD Ryzen™ AI Embedded P100 Series Prozessoren mit 4 oder 6 Kernen und sind für den Industriellen Temperaturbereich von -40 °C bis +85° C erhältlich […]
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congatec – the leading provider of embedded and edge computing technology – today launched a new COM Express 3.1 Type 6 Compact module series. The new conga-TCRP1 modules are based on the latest AMD Ryzen™ AI Embedded P100 Series processors with 4 or 6 cores and support the industrial temperature range from -40 to +85 °C. […]
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congatec – a leading vendor of embedded and edge computing technology – is expanding its Computer-on-Module portfolio with 18 new JUMPtec product families. The move follows the acquisition of Kontron’s module business in July 2025. As a result, customers now have access to the world’s most comprehensive range of application-ready COM-HPC, COM Express, SMARC, and […]
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congatec – a leading vendor of embedded and edge building blocks – today launched the industry’s broadest portfolio of Computer-on-Modules (COMs) based on Intel Core Ultra Series 3 processors . The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI acceleration. In most scenarios, the modules‘ high level of […]
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congatec – a leading vendor of embedded and edge computing technology – and Kontron – a leading global provider of IoT/Embedded Computer Technology (ECT) – today announced new modular and secure embedded platforms. At the core of this collaboration is the integration of KontronOS, Kontron’s secure, Linux®-based operating system, with congatec’s application-ready aReady.COM hardware and […]
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congatec – ein führender Anbieter von Embedded und Edge Computer Technologie – präsentiert gemeinsam mit Kontron – einem weltweit führenden Anbieter von Embedded- und IoT-Lösungen – neue, modulare und sichere Embedded-Plattformen. Im Mittelpunkt steht dabei die Kombination von KontronOS, dem sicheren Linux®-basierten Betriebssystem von Kontron, und den applikationsfertigen aReady.COM Hardware- und Software Building-Blocks von congatec. […]
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