Autor: Firma congatec

aReady.COM conga-SMX95 optimiert Time-to-Market und Nutzungsmöglichkeiten

congatec – der führende Anbieter von Embedded und Edge Computing Technologie – überführt sein Angebot an applikationsfertigen aReady. Software-Building-Blocks nun auch auf seine Arm basierten Computer-on-Modules. Den Anfang macht das erfolgreiche SMARC Module conga-SMX95 auf Basis der i.MX95 Applikationsprozessoren von NXP Semiconductor. OEM profitieren von dem neuen aReady.COM mit applikationsfertigen Hardware- und Software-Buildingblocks inklusive OS, […]

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aReady.COM conga-SMX95 optimizes time-to-market and expands usage potential

congatec – the leading provider of embedded and edge computing technology – is extending its portfolio of application-ready aReady. software building blocks to include Arm-based Computer-on-Modules. The first product in this expansion is the successful SMARC module conga-SMX95, based on NXP® Semiconductors’ i.MX 95 applications processors. With application-ready hardware and software building blocks – including […]

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congatec and Kontron partner on embedded computing solutions

congatec – the leading provider of embedded and edge computing technology – is expanding its portfolio of customized embedded computing platforms. With the launch of the aReady.YOURS Partner Program, the company is strengthening its ability to deliver added value to OEMs. The aim is to work with solution partners to develop turnkey systems for markets […]

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congatec und Kontron schließen Partnerschaft für Embedded Computing Lösungen

congatec – der führende Anbieter von Embedded und Edge Computing Technologie – erweitert sein Lösungsangebot für kundenspezifische Embedded-Computing-Plattformen. Mit dem aReady.YOURS-Partner-Programm zündet das Unternehmen die nächste Wertschöpfungsstufe für OEMs. Ziel ist es, gemeinsam mit Lösungspartnern schlüsselfertige Systemdesigns für Märkte mit hohen regulatorischen Anforderungen und hohen bautechnischen Anforderungen zu entwickeln. Mit aReady.YOURS übernimmt congatec die Entwicklung […]

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conga-TCRP1 combines high performance with maximum scalability and design flexibility

congatec – the leading vendor of embedded and edge computing technology – is enhancing the performance and scalability of its AMD Ryzen™ AI Embedded P100 Series COM Express 3.1 Type 6 Compact modules. The conga-TCRP1 is now available in six new variants with eight, ten, or twelve CPU cores. This makes them an ideal fit for cost-sensitive designs […]

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Skalierbare Edge-Performance für anspruchsvolle Applikationen

congatec – der führende Anbieter von Embedded- und Edge-Computing-Technologie – erhöht die Performance und Skalierbarkeit seiner AMD Ryzen AI Embedded P100 Series basierten COM Express 3.1 Type 6 Compact Module. Das conga-TCRP1 ist ab sofort in sechs neuen Varianten mit 8, 10 oder 12 CPU-Kernen verfügbar. Dadurch eignet es sich ideal für kostenoptimierte Designs, die […]

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aReady.YOURS from congatec for fast and reliable (full) custom embedded computing designs

congatec – the leading provider of embedded and edge computing technology – today announced its new Customer Application Center and the launch of aReady.YOURS. With this move, congatec expands its aReady. hardware and software building blocks portfolio to include comprehensive customization design and software integration services, delivering near turnkey embedded computing platforms to OEM customers. aReady.YOURS supports customers throughout […]

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congatec expands its highly skilled engineering team, establishing congatec Asia Embedded Design subsidiary

congatec – the leading vendor of embedded and edge computing technology – today announced the establishment of its new subsidiary in Penang, Malaysia, marking a strategic expansion of its engineering and research footprint in Asia. The move signals congatec’s commitment to anchoring high-value embedded computing design, customisation and technical support capabilities in Malaysia as part […]

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congatec launcht COM Express Compact Modul auf Basis der neuesten AMD Ryzen™ AI Embedded P100 Prozessorserie

congatec – der führende Anbieter von Embedded- und Edge-Computing-Technologie – gibt den Launch einer neuen COM Express 3.1 Type 6 Compact Modulserie bekannt. Die neuen conga-TCRP1 basieren auf den neuesten AMD Ryzen™ AI Embedded P100 Series Prozessoren mit 4 oder 6 Kernen und sind für den Industriellen Temperaturbereich von -40 °C bis +85° C erhältlich […]

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congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series

congatec – the leading provider of embedded and edge computing technology – today launched a new COM Express 3.1 Type 6 Compact module series. The new conga-TCRP1 modules are based on the latest AMD Ryzen™ AI Embedded P100 Series processors with 4 or 6 cores and support the industrial temperature range from -40 to +85 °C. […]

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